Search results for "Wire bonding"
showing 3 items of 3 documents
Studies for low mass, large area monolithic silicon pixel detector modules using the MALTA CMOS pixel chip
2021
Abstract The MALTA monolithic silicon pixel sensors have been used to study dicing and thinning of monolithic silicon pixel detectors for large area and low mass modules. Dicing as close as possible to the active circuitry will allow to build modules with very narrow inactive regions between the sensors. Inactive edge regions of less than 5 μ m to the electronic circuitry could be achieved for 100 μ m thick sensors. The MALTA chip (Cardella et al., 2019) also offers the possibility to transfer data and power directly from chip to chip. Tests have been carried out connecting two MALTA chips directly using ultrasonic wedge wire bonding. Results from lab tests show that the data accumulated in…
300°C SiC Blocking Diodes for Solar Array Strings
2009
Silicon Carbide 300V-5A Ni and W Schottky diodes with high temperature operation capability (up to 300°C) have been fabricated. This paper reports on the stability tests (ESA space mission to Mercury, BepiColombo requirements) performed on these diodes. A DC current stress of 5A has been applied to these diodes at 270°C for 800 hours. These reliability tests revealed both, degradation at the Schottky interface (forward voltage drift) and at the diode top surface due to Aluminum diffusion (bond pull strength degradation). The use of W as Schottky metal allows eliminating the forward voltage drift producing stable metal–semiconductor interface properties. Nevertheless, SEM observations of the…
Improving the Quality Management of the Thermosonic Welding Process of Gold Wires in Automotive Industry
2018
Abstract This scientific paper conducts a study meant to improve the quality management of the thermosonic welding process of gold wires in the automotive industry. Within the large amount of electronic products manufactured worldwide, the gold wire bonding is the preferred technology for creating the needed interconnections in the microelectronic industry. In this paper, the quality management improving starts with an experimental research in the automotive industry, based on the gold wire thermosonic bonding, in terms of: conformal structuring, robustness and integrity of the electrical contacts. The experimental research is based on the processing parameters and on the independent variab…